A New Thermally Stable Polyimide Film for Advanced Microelectronics Packaging
نویسندگان
چکیده
منابع مشابه
Preparation and Characterization of a Bionanopolymer Film for Packaging Applications (a Case Study: Walnut Packaging)
The carboxymethyl cellulose (CMC)/polyvinyl alcohol (PVA) film were prepared by adding three levels of nanoclay particles (0.5, 1 and 3%) using solution casting evaporation method. The incorporation of nanoclay on mechanical, water vapor permeability, and oxygen barrier properties of CMC/PVA-based film was investigated. The best result was obtained through the nanocomposite film contain 3% nano...
متن کاملPreparation and characterization of a bionanopolymer film for walnut packaging
To apply the nanomaterial as a component in the packaging material structure, in this research, the carboxymethyl cellulose (CMC)/polyvinyl alcohol (PVA) film were prepared with three levels of nanoclay particles (0.5, 1 and 3%) using solution casting evaporation method. The incorporation of nanoclay on mechanical, water vapor permeability, and oxygen barrier properties of CMC/PVA-based film wa...
متن کاملHigh Reliability Plastic Packaging for Microelectronics
This Laboratory Directed Research & Development (LDRD) project conducted in fiscal years 1996 and 1997 under case 3526.030 was devoted to the development of test structures and associated measurement methodology for assessing the reliability of plastic encapsulated microelectronic devices. The end goal was the conceptual specification of one or more Assembly Test Chips (ATCs) which could be use...
متن کاملEuropean Microelectronics and Packaging Symposium
An advanced substrate level patterning technique is presented to realize 3D interconnection circuitry on electronic modules. The technique is based on diffraction of light by phase gratings. The phase gratings are incorporated into the photomask at discrete locations. By illuminating the photomask at normal incidence, the phase grating causes locally inclined UV exposure, which is used to expos...
متن کاملReliability Considerations for Advanced Microelectronics
Recent advances in the design and fabrication techniques of microelectronic devices have resulted in tremendous improvements in system functionality, performance and power consumption. These improvements have been fueled by tremendous growth in the semiconductor industry and increasing demand for hand-held and wireless electronic systems. However, these same advances also impact the stability, ...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of Photopolymer Science and Technology
سال: 2008
ISSN: 0914-9244,1349-6336
DOI: 10.2494/photopolymer.21.95